Company Description Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering
Job Description: Job Description The MAP Structure team operates as a direct extension of the Design Office on the Final Assembly Line (FAL) and Customer Line. We hold delegated responsibilities in Design, Stress, and Chief Engineering
Job Description: Job Description Accountabilities The job holder will support the A320 Fuselage equipping project in Tianjin as ME Technical Shopfloor Support. Main activities Analyse and support all of folio points (Structure, Electrical & Mechanical): S0x,
Responsibilities: Implement and verify Scan, MBIST, and Boundary Scan solutions for complex SoC designs. Perform scan insertion, DFT DRC checking, and scan chain validation to ensure testability and design quality. Analyze fault coverage and develop ATPG
Job Description: Understand the semiconductor market and translate market requirements to packaging effectively. Responsible for the design, development, execution, and implementation of packaging product, structures, or assembly process technologies. Address and solve materials and processing issues
Job Description Job Purpose and Dimensions: Develop, qualify, validate, design-in, and support next-generation IC products for applications such as Opamp, interface and Isolation chip. Principal Accountabilities: • Design, debug and test new products and support old