Company Description Job Summary • Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, wafer level, flip-chip, multi-chip module and power device packaging, GaN related PKG is a plus.
When joining PerkinElmer, you select an experienced and trusted leader in scientific solutions, with the support of a global service network and distribution centers, providing the right solution, at the right time, to meet critical customer needs.
· Power Semiconductor Assembly EOL Process Development · Technical Leadership on Enabling Technology Development and Feasibility Study in Pro-typing Line · Technical Leadership on Responsible Processes between Package development and Manufacturing · Proto Typing Samples Building
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