Tätigkeitsbereich:Forschung & Entwicklung incl. Design Fachabteilung:Research & Development Hardware & System Solution Gesellschaft:Mercedes-Benz Digital Tech Ltd. Standort:Shanghai, Xingchi Tower, No. 399, Keqiao Road, Jinqiao, Pudong Startdatum:sofort Veröffentlichungsdatum:11.08.2026 Stellennummer:MER000469D Arbeitszeit:Vollzeit Bewerben Aufgaben Objective: Responsible and drive the hardware
Company Description Do you want beneficial technologies being shaped by your ideas? Whether in the areas of mobility solutions, consumer goods, industrial technology or energy and building technology - with us, you will have the chance to
Challenge Yourself and Impact the Future! MacDermid Alpha Electronics Solutions, a business segment of Element Solutions Inc (NYSE: ESI), is renowned worldwide for its commitment to revolutionizing the electronics industry. With a legacy spanning over a century, we
Company Description Do you want beneficial technologies being shaped by your ideas? Whether in the areas of mobility solutions, consumer goods, industrial technology or energy and building technology - with us, you will have the chance to
Company: Qualcomm China Job Area:Engineering Group, Engineering Group Hardware Applications Engineering General Summary: Job Overview We are looking for a senior ASIC NPI (New Product Introduction) Support Engineer with rich end-to-end chip delivery experience. This role
At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology. Role Expectations The Application Engineer will serve as the primary technical consultant for MSC Nastran solutions, providing
About us Our mission is to reinvent the way people learn, starting with language. Learning a language can change a life by opening doors to new cultures, careers, and communities. Two billion people around the world
Company Description Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering
Company Description Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering
Company Description Job Summary • Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, wafer level, flip-chip, multi-chip module and power device packaging, GaN related PKG is a plus. • Package