Logitech is the Sweet Spot for people who want their actions to have a positive global impact while having the flexibility to do it in their own way. Department: C4C HW Engineering Role Summary We are
Job Description Key Responsibilities - Take on wire bonding (WB) process development for new products and packages (e.g., Cu/Au wire), including establishing process window and bonding conditions independently. - Drive NPI activities covering development validation, data analysis, yield improvement,
Challenge Yourself and Impact the Future! MacDermid Alpha Electronics Solutions, a business segment of Element Solutions Inc (NYSE: ESI), is renowned worldwide for its commitment to revolutionizing the electronics industry. With a legacy spanning over a
Main Responsibilities * 负责完成品及半成品的包装结构设计,与供应商协调,对包装结构进行打样和完成包装试验 Take the responsibility of the package structure design, coordinate with supplier, arrange the package samples and complete the testing * 制作产品包装结构文件(技术图纸、产品包装说明书,产品包装方式文件,产品堆放文件,包装结构文件,包装材料BOM清单等系列相关文件,并及时更新文件及相关数据资料，使文件始终处于受控状态 Creating the product package structure files (include drawing, UPA, Package BOM list) * 参与解决量产产品在生产过程中出现的包装异常问题，以及因包装研发不当造成的质量问题 Improve
Challenge Yourself and Impact the Future! MacDermid Alpha Electronics Solutions, a business segment of Element Solutions Inc (NYSE: ESI), is renowned worldwide for its commitment to revolutionizing the electronics industry. With a legacy spanning over a