New package technology and platform module development (Si-gel filled module). Technical leadership on new power module technology and enabling technology for automotive/industrial application. Technical interface for package team, communication with business unit, marketing, device TD, quality/reliability, manufacturing
Duties & Responsibilities Familiar with semiconductor process and high-end packaging process. Having mechanics and thermodynamics knowledge is prefer. Experience in thermal analysis is prefer, understand FloTherm or Ansys. Understand quality solutions, Minitab, or other reliability and statistical
Job Description Essential Functions: 1. Properly forecast and close deals at designated existing OEM accounts 2. Identify and acquire prospective OEM accounts. 3. Define and execute development plan at OEM accounts. 4. Utilize Cognex sales process for
Company Overview KLA is a global leader in diversified electronics for the semiconductor manufacturing ecosystem. Virtually every electronic device in the world is produced using our technologies. No laptop, smartphone, wearable device, voice-controlled gadget, flexible screen,
Job Summary: Lead timely and effective new product introduction from engineering build through qualification and initial manufacturing release. Drive design-for-manufacturability, process readiness, first-pass qualification success, yield improvement, cost competitiveness, and smooth transfer to production in alignment
Company: Qualcomm China Job Area:Sales, Business Development & Marketing Group, Sales, Business Development & Marketing Group Product Marketing General Summary: Senior/Staff manager for industrial product management, the main coverage is: 1. Product Strategy & Roadmap Definition: Support the
Your mission will be to improve the mechanical design, design-to-cost and design for manufacturing of the company products. You will troubleshoot and find solutions to the component manufacturing, product assembly and supplier quality issues that may