Locations: Suzhou, China Categories: Engineering Req ID: 91990 ADVANCE YOUR CAREER. ADVANCE THE WORLD. At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to
Locations: Suzhou, China Categories: Engineering Req ID: 91989 ADVANCE YOUR CAREER. ADVANCE THE WORLD. At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to
Job Description Design and develop Power Modules which use embedded die laminate technology with SMT of Cap and Inductor for Renesas’s packaging needs in the areas of Commercial Industrial power device packaging for servers and AI. Define package
Company Description Job Summary • Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, wafer level, flip-chip, multi-chip module and power device packaging, GaN related PKG is a plus. •
Company Description Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering product
Company Description Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering product