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Job Description Key Responsibilities - Take on wire bonding (WB) process development for new products and packages (e.g., Cu/Au wire), including establishing process window and bonding conditions independently. - Drive NPI activities covering development validation, data analysis, yield improvement, SPC
About ANZEN Engineering: Habilidades, experiencia, cualificaciones. Si tiene el perfil adecuado para esta oportunidad, asegúrese de inscribirse hoy mismo. is a leading engineering company specialized in supporting the development and certification of Safety- Critical & Mission-Critical
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