Location: Fully Remote Type: Internship (Unpaid / High Learning & Portfolio Impact) Duration: 3 – 6 Months Pathways: Direct consideration for Full-Time & Paid Roles upon successful completion About Wing Wing is on a mission to
Company: Qualcomm China Job Area:Engineering Group, Engineering Group Software Engineering General Summary: Responsibilities The candidate will work as an DSP SME(Subject Matter Expert) to develop DSP features, solve bugs and collaborate with global DSP teams to
Company: Qualcomm China Job Area:Engineering Group, Engineering Group Software Engineering General Summary: General Summary: The Qualcomm Global Automotive team is actively engaged in offering optimized solutions to enable customers with leading edge systems. We are seeking
Tätigkeitsbereich:Forschung & Entwicklung incl. Design Fachabteilung:Research & Development Hardware & System Solution Gesellschaft:Mercedes-Benz Digital Tech Ltd. Standort:Shanghai, Xingchi Tower, No. 399, Keqiao Road, Jinqiao, Pudong Startdatum:sofort Veröffentlichungsdatum:03.08.2026 Stellennummer:MER00046PN Arbeitszeit:Vollzeit Bewerben Aufgaben Objectives： Responsible for hardware platform enablement
As a Field Applications Engineer, the candidate will be responsible SiC market investigation and technical field support of onsemi SiC Bare Die and Module products. The candidate shall be willing to provide technical engagement with customers,
At NVIDIA, we build groundbreaking products for the following sectors: Deep Learning, High Performance Computing, Gaming, VR, and Automotive. See your efforts in action as developers use your tools to debug, profile and analyze the performance of
