Location: Fully Remote Type: Internship (Unpaid / High Learning & Portfolio Impact) Duration: 3 – 6 Months Pathways: Direct consideration for Full-Time & Paid Roles upon successful completion About Wing Wing is on a mission to
Some careers have more impact than others. If you’re looking for a career where you can make a real impression, join HSBC and discover how valued you’ll be. We are currently seeking an experienced professional to
Job ID 515955 Posted since 29-Jul-2026 Organization Digital Industries Field of work Research & Development Company Siemens Industry Software Limited, Taiwan Branch Experience level Mid-level Professional Job type Full-time Work mode Office/Site only Employment type Permanent
About A1 There are over 5 billion users using basic applications today such email, notes, tasks that are not AI-native. Our mission is to build a proactive smart assistant for everyday users to bring intelligence to
技术美术实习（写实项目） 杭州 实习 互联网 / 电子 / 网游 职位描述 1、准确理解工作需求，编写Shader实现美术相关需求、提升现有项目技术在产品中的实际表现。2、根据美术要求进行3dsMax、Maya、Blender及其他生产软件的工具及插件开发。3、协助美术人员和程序人员优化游戏运行效率；4、配合团队研究新的美术效果，协助设计相应的生产管线。 职位要求 1、掌握计算机图形学的基础知识，对图形学中的光照模型及线性代数有一定了解，熟悉GLSL或HLSL，能用Shader实现光影渲染及其他预期效果；2、熟悉主流美术软件，Blender、3dsMax、Maya、ZBrush、Substance Painter等。3、具有良好的审美，了解常规PBR资产基础制作流程规范；4、具有良好的沟通、协作能力和团队精神，思路清晰有耐心；5、熟悉至少一种主流游戏引擎：如Unity3D、Unreal等；6、熟悉设计模式等计算机基础知识，至少可以独立编写一种面向对象的编程语言，如C#、C++等，并且具备一定Debug代码的能力；7、26届或27届，每周实习4-5天，实习3个月以上。 投递...
Company: Qualcomm China Job Area:Engineering Group, Engineering Group Software Engineering General Summary: Responsibilities The candidate will work as an DSP SME(Subject Matter Expert) to develop DSP features, solve bugs and collaborate with global DSP teams to
Company: Qualcomm China Job Area:Engineering Group, Engineering Group Software Engineering General Summary: General Summary: The Qualcomm Global Automotive team is actively engaged in offering optimized solutions to enable customers with leading edge systems. We are seeking
Tätigkeitsbereich:Forschung & Entwicklung incl. Design Fachabteilung:Research & Development Hardware & System Solution Gesellschaft:Mercedes-Benz Digital Tech Ltd. Standort:Shanghai, Xingchi Tower, No. 399, Keqiao Road, Jinqiao, Pudong Startdatum:sofort Veröffentlichungsdatum:03.08.2026 Stellennummer:MER00046PN Arbeitszeit:Vollzeit Bewerben Aufgaben Objectives： Responsible for hardware platform enablement
About A1 There are over 5 billion users using basic applications today such email, notes, tasks that are not AI-native. Our mission is to build a proactive smart assistant for everyday users to bring intelligence to
As a Field Applications Engineer, the candidate will be responsible SiC market investigation and technical field support of onsemi SiC Bare Die and Module products. The candidate shall be willing to provide technical engagement with customers,
At NVIDIA, we build groundbreaking products for the following sectors: Deep Learning, High Performance Computing, Gaming, VR, and Automotive. See your efforts in action as developers use your tools to debug, profile and analyze the performance of
About A1 There are over 5 billion users using basic applications today such email, notes, tasks that are not AI-native. Our mission is to build a proactive smart assistant for everyday users to bring intelligence to
Tätigkeitsbereich:Forschung & Entwicklung incl. Design Fachabteilung:Vehicle Components & Tech Center China Gesellschaft:Mercedes-Benz Group China Ltd. Standort:Mercedes-Benz Group China Ltd., Beijing Startdatum:sofort Veröffentlichungsdatum:17.08.2026 Stellennummer:MER0004740 Arbeitszeit:Vollzeit Bewerben Aufgaben Objective: Design, integrate, debug, and maintain vehicle EE measurement and simulation devices,