Electronic Packaging Engineer 招聘在 Beijing (Peking) - 2 Job Positions Available

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electronic packaging engineer 招聘在 Beijing (Peking)

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MB.OS System Integration Engineer MB.OS 系统集成工程师

Mercedes-Benz Group AG ( Beijing )

Tätigkeitsbereich:Forschung & Entwicklung incl. Design Fachabteilung:RD China Gesellschaft:Mercedes-Benz Group China Ltd. Standort:Mercedes-Benz Group China Ltd., Beijing Startdatum:sofort Veröffentlichungsdatum:08.06.2026 Stellennummer:MER00043DM Arbeitszeit:Vollzeit Bewerben Aufgaben Objective of Job Design mule car of electrical and electronic architecture (ADAS + Infotainment) for

Mercedes-Benz Group AG 28天前发布

Experienced Board Power Designer

Ericsson ( Beijing )

Join our Team What you will do: Board power solution and design for radio products, Baseband products and network router products. DCDC power solution design, including lightning protection, polarity protection, hot-swap, EMC filter, power stage and

Premium Full-time Craft Layout Design Schematic Circuit Router

Ericsson 20天前发布

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Electronic Packaging Engineer 招聘在 Beijing (Peking) - 2 Job Positions Available

MB.OS System Integration Engineer MB.OS 系统集成工程师

Experienced Board Power Designer

Drive System Function Integration & Commissioning Engineer

Drive System Vehicle Interface Integration Engineer

Drive System Vehicle Interface Integration Engineer

MBOS System Integration Process & Outsourcing Strategy

Program Management, Automated Driving & Parking System项目群管理，...

Functional Design Architect (Body)功能设计架构师（车身）

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Electronic Packaging Engineer 招聘 在 Beijing (Peking) - 2 Job Positions Available

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Electronic Packaging Engineer 招聘在 Beijing (Peking) - 2 Job Positions Available