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Electronic Packaging Engineer Jobs In Beijing (Peking) - 5 Job Positions Available

1 – 5 of 5 jobs
Mercedes-Benz Group AG jobs

Tätigkeitsbereich:Forschung & Entwicklung incl. Design Fachabteilung:Body Electrical Integration, Sound, NVH & Aero Gesellschaft:Mercedes-Benz Group China Ltd. Standort:Mercedes-Benz Group China Ltd., Beijing Startdatum:01.10.2026 Veröffentlichungsdatum:17.08.2026 Stellennummer:MER00047HE Arbeitszeit:Vollzeit Bewerben Aufgaben Objective 1. Leading the sound component development in China

Mercedes-Benz Group AG  26 days ago
Mercedes-Benz Group AG jobs

Tätigkeitsbereich:Forschung & Entwicklung incl. Design Fachabteilung:RD China Gesellschaft:Mercedes-Benz Group China Ltd. Standort:Mercedes-Benz Group China Ltd., Beijing Startdatum:12.10.2026 Veröffentlichungsdatum:03.09.2026 Stellennummer:MER000481J Arbeitszeit:Vollzeit Bewerben Aufgaben Objectives: Build up and continuously optimise RD project quotation / cost assessment model for

Mercedes-Benz Group AG  9 days ago
KLA jobs

Company Overview KLA is a global leader in diversified electronics for the semiconductor manufacturing ecosystem. Virtually every electronic device in the world is produced using our technologies. No laptop, smartphone, wearable device, voice-controlled gadget, flexible screen, VR device

KLA  9 days ago
KLA jobs

Company Overview KLA is a global leader in diversified electronics for the semiconductor manufacturing ecosystem. Virtually every electronic device in the world is produced using our technologies. No laptop, smartphone, wearable device, voice-controlled gadget, flexible screen, VR device

KLA  19 days ago
Ericsson jobs

Join our Team About the opportunity We are now looking for a passionate fresh graduate to join our Board Power Design team as a Board Power Design Engineer. In this role, you will contribute to the development

Ericsson  8 days ago

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