Littelfuse (NASDAQ: LFUS) is a diversified industrial technology manufacturing company shaping solutions for the safe and efficient transfer of electrical energy. Headquartered in Chicago, Illinois, USA, we serve customers across industrial, transportation, and electronics markets worldwide.
产品工程师/专家（PE） 上海、杭州 全职 研发 - 电子 / 半导体 职位描述 1. 负责芯片从TO前到量产阶段工程相关的计划制定，和设计团队、fab、封装厂、测试团队、市场等环节配合，推动芯片的验证和量产导入工作。2. 负责产品良率的管理与提升，通过分析工艺数据、测试数据，分析失效问题，确定工程问题和良率问题的根本原因，推动责任方采取解决和预防措施，提升产品良率和性能。3. 负责芯片产品量产阶段的维护工作，管理制造流程的变更和变异，确保产品按计划稳定量产和维持质量要求。4. 协助QA、RE等完成产品可靠性验证以及客退失效产品的失效分析，确定原因并落实改善措施5. 支持供应链相关的工程维护等工作。6. 完善NPI导入流程，积极参与部门与公司内部流程建设和跨部门交流等。 职位要求 1. 本科及以上学历，半导体、微电子、物理、材料、集成电路等相关专业2. 深入了解半导体制造技术，熟悉封测、可靠性测试、ATE测试等相关知识，5年以上半导体相关工作经验。有工艺开发、产品工程师、封装工程等工作经验优先。3. 对于数据敏感，熟练使用数据分析方法和工具，如JMP、PDF solution等。4. 有责任心，较强的抗压能力，善于沟通协调资源，分析问题条理清晰。 投递...
The group you’ll be a part of The Customer Support Business Group focuses on enabling our customers with premier customer support throughout their lifecycle with Lam. We drive performance, productivity, safety, and quality of customers installed
Company Overview KLA is a global leader in diversified electronics for the semiconductor manufacturing ecosystem. Virtually every electronic device in the world is produced using our technologies. No laptop, smartphone, wearable device, voice-controlled gadget, flexible screen,
Overview Bruker’s Nano Surface and Metrology (BNSM) Division is the leader of advanced X-ray, AFM, and other various metrology products for semiconductor IC and compound semiconductor industries. The BNSM division offers the most comprehensive portfolio of
Job Responsibility: 1. Work with worldwide cross-functional teams on Automotive new silicon/product development and qualification, from early phases of product definition to production phase. 2. Develop and support test solutions with Test Engineering from early phase
Job Responsibility: 1. Work with worldwide cross-functional teams on Automotive new silicon/product development and qualification, from early phases of product definition to production phase. 2. Develop and support test solutions with Test Engineering from early phase
Who We Are Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our
About VAT Group At VAT, we change the world with vacuum solutions. As the world’s leading supplier of high-performance vacuum valves, we have been driving innovation for more than 60 years. With over 3,200 employees worldwide,
Company Overview KLA is a global leader in diversified electronics for the semiconductor manufacturing ecosystem. Virtually every electronic device in the world is produced using our technologies. No laptop, smartphone, wearable device, voice-controlled gadget, flexible screen,
Who We Are Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our
Job descriptions may display in multiple languages based on your language selection. What we offer: At Magna, you can expect an engaging and dynamic environment where you can help to develop industry-leading automotive technologies. We invest
自研芯片-采购经理（半导体设计） 上海 全职 供应链板块 职位描述 【岗位职责】1、主动参与研发项目早期讨论，理解芯片/模块的设计目标、性能指标（PPA：性能、功耗、面积）、功能需求、应用场景、技术路线图；2、解读设计规格，识别特殊工艺/材料需求、潜在的技术挑战，了解半导体制造流程（Fab， 封装， 测试）及其对材料，工艺选择的影响；3、根据设计需求，主动寻找、筛选、评估潜在的半导体原材料、设备、IP、EDA工具、Foundry/封测服务等供应商；4、组织或参与供应商技术交流，评估其技术能力、工艺水平、产品质量、研发路线图是否匹配项目需求，并进行供应商资质审核（技术、质量、产能、交付、服务、合规性、可持续性等）；5、收集并分析元器件、材料、工艺、IP、EDA工具、代工服务的市场动态、技术趋势、价格走向、供应商格局、替代方案、风险（如：供货稳定性、地缘政治）等，提供市场和技术情报；6、进行详细的成本拆解（Die Cost， Wafer Cost， Packaging Cost, Test Cost, NRE等），提供成本优化建议（如：替代物料、工艺简化、设计优化可能性），进行TCO分析；7、基于技术可行性、成本、质量、交期、风险等因素，综合评估不同供应商或技术方案，向研发团队提供数据支撑的选型建议，并参与设计评审；8、负责半导体相关物料和服务的询价、比价、议价、合同谈判（包括NRE、MPW、量产订单等）；9、与项目经理、产品经理、设计工程师、工艺工程师、质量工程师等紧密合作，全程参与新产品开发流程；【任职要求】1、本科及以上学历，微电子、电子工程、材料科学、物理、化学、等相关专业优先（尤其是半导体相关）；2、5年以上半导体行业工作经验，具有半导体设计公司、Foundry、IDM、设备材料厂商的技术采购、供应商管理、研发支持、产品工程、工艺工程等背景者优先，有Fab厂采购、EDA/IP采购、IC设计服务采购、关键原材料采购经验者尤佳；3、对半导体器件物理、制造工艺（光刻、刻蚀、沉积、CMP等）、封装技术、测试原理、EDA工具流程有基础到中等的理解，能看懂基本的技术规格书、芯片架构框图、工艺流程图，了解半导体材料、设备、IP核的基本知识；3、熟悉半导体设计供应链资源，丰富的采购寻源工作经验，掌握行业上下游信息；4、具备出色的跨部门沟通协调能力、商务谈判能力、业务开拓能力和执行能力，能在技术和商务语言间自如切换，清晰表达观点和建议，在个人专业方向可以独当一面；5、有良好的敬业精神和职业道德操守，责任心强，合规意识强；6、英语听说读写优秀，可进行口语交流；7、具备良好的数据统计与分析能力，熟练使用各种办公软件。 职位要求 - 投递...
About VAT Group At VAT, we change the world with vacuum solutions. As the world’s leading supplier of high-performance vacuum valves, we have been driving innovation for more than 60 years. With over 3,200 employees worldwide,
Littelfuse (NASDAQ: LFUS) is a diversified industrial technology manufacturing company shaping solutions for the safe and efficient transfer of electrical energy. Headquartered in Chicago, Illinois, USA, we serve customers across industrial, transportation, and electronics markets worldwide.
JLL empowers you to shape a brighter way. Our people at JLL are shaping the future of real estate for a better world by combining world class services, advisory and technology for our clients. We are
PTE产品工程师（IC部） 上海 正式 芯片类 职位描述 1.芯片制造中异常分析：发现并处置制造中良率以及其他生产异常，制定改善对策，跟踪对策实施以及改善效果。2.芯片制造中的数据监控：跟踪日常CP/FT/SLT生产良率，为计划提供准确的良率数据，并及时预警潜在的良率问题，保证芯片交付目标达成。3.芯片制造良率提升：对制造良率数据进行分析，找出影响良率的关键因素，推动fab/封装/测试/设计等采取预防和纠正措施。4.芯片客诉分析：掌握芯片的各模块功能，以及了解测试内部。运用专业知识，定位或协助定位客诉的根因；5.与其他团队合作：与设计工程师、验证工程师、AE、ATE等密切合作，共同解决产品测试和验证过程中的问题，确保产品的质量和可靠性。 职位要求 1.本科及以上学历，电子工程、微电子或相关专业；2.具备一定的英语读写能力，具备英文汇报的能力；3.注重细节和准确性，具备良好的质量意识。能够独立分析问题、解决问题，并与团队合作解决复杂的测试和验证问题；4.良好的沟通和协调能力，后续需要与多个团队合作，包括设计团队、运营团队等沟通； 投递...
Position Description Staff Product engineer for SiC CJFET Division for New Product Development Candidate responsibilities include, but are not limited to: Lead High Power SiC JFET New Product Development and Package Development (NPD) projects Facilitate and
Who We Are Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our
New package technology and platform module development (Si-gel filled module). Technical leadership on new power module technology and enabling technology for automotive/industrial application. Technical interface for package team, communication with business unit, marketing, device TD, quality/reliability,