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Package Engineer 深圳 社招 全职 智能制造 / 工业互联网 / 工业自动化 职位描述 芯片封装设计和实现，包括先进封装技术（2.5D、3D、Hybrid Bonding等) 职位要求 • 本科及以上学历，材料、机械、电子等相关专业• 5年以上芯片封装设计经验• 精通封装设计工具（如APD/SiP）• 熟悉多种封装形式（QFN、BGA、WLCSP等）• 了解先进封装技术（2.5D/3D/Chiplet）• 具备封装热/电/力学仿真能力 投递...
Job Title:Package Engineer-Production Summary:1.Ensure safe, reliable and efficient packaging operations through engineering support and continuous improvement initiatives. 2.Lead packaging readiness and industrialization activities for new product introductions and process transfers. 3.Drive automation, MES and smart manufacturing projects
Additional Information Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer
SummaryIn this highly visible role, you will serve as the operation expert in manufacturing process, yields, and factory readiness for mass production, partnering with a cross-functional team that includes design, supplier quality, test, service, and technical
Company Description Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering
Company Description Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering
Monolithic Power Systems, Inc. (MPS) is one of the fastest growing companies in the Semiconductor industry. We are worldwide technical leaders in Integrated Power Semiconductors and Systems Power delivery architectures. At MPS, we cultivate creativity, are
Monolithic Power Systems, Inc. (MPS) is one of the fastest growing companies in the Semiconductor industry. We are worldwide technical leaders in Integrated Power Semiconductors and Systems Power delivery architectures. At MPS, we cultivate creativity, are
Company Description Job Summary • Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, wafer level, flip-chip, multi-chip module and power device packaging, GaN related PKG is a plus.
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