Company: Qualcomm China Job Area:Engineering Group, Engineering Group Software Engineering General Summary: Join our China IoT Audio Software Development team and deliver high-quality audio/voice solutions on Qualcomm SoCs for Snapdragon IoT platforms. Skills/Experience 5+ years of C/C++
Job Details: Job Description: This role is an exciting opportunity to apply AI/Bigdata technology to translate manufacturing data into meaningful insights to help solve factory yield/process engineering problems. In this position, you are expected to deliver data
岗位职责： 1. 兼顾Wire Bond（引线键合）工序工艺管控+设备运维全模块工作； 2. 负责金线/铝线/铜线焊线制程参数优化、量产良率管控、打火不良、断线、拉力不达标等工艺异常整改； 3. 负责焊线机台日常保养、故障维修、设备校准、机台稼动率提升； 4. 完成焊线工序新产品导入、工艺验证、工艺文件编制； 5. 统筹焊线工序工艺和设备类问题闭环，推进产线标准化落地。 任职基本要求： 1. 学历：全日制本科及以上学历，微电子、电子信息、材料工程、机械自动化、测控工程等相关理工科专业优先； 2. 工作经验：3年及以上半导体封装测试工厂量产工作经验，熟悉半导体封装工艺流程、产线运作逻辑； 3. 技能基础：熟悉半导体行业标准、生产SOP、异常分析、8D报告、良率优化流程；能独立对接产线、研发、品质跨部门协同工作； 4. 综合素质：逻辑清晰，具备独立问题排查与项目推进能力；熟悉洁净车间生产规范；可配合产线需求轮班/应急加班；熟练使用Office办公软件； 加分项： 具备键合拉力、球剪测试实操经验；熟悉半导体引线键合行业标准优先。 Why TI? Engineer your future. We empower our employees to truly own their career
岗位职责： 1. 负责半导体Molding（环氧塑封）工序全流程工艺管控、参数优化、量产制程维护； 2. 解决塑封工序溢料、空洞、分层、翘曲、封装开裂等工艺量产不良； 3. 负责塑封料物料验证、固化工艺优化、产品外观及电性一致性管控； 4. 编制塑封工序工艺标准、生产管控文件，推进制程能力CPK提升； 5. 参与封装产品结构评审、新产品塑封方案落地与试产跟进。。 任职基本要求： 1. 学历：全日制本科及以上学历，微电子、电子信息、材料工程、机械自动化、测控工程等相关理工科专业优先； 2. 工作经验：3年及以上半导体封装测试工厂量产工作经验，熟悉半导体封装工艺流程、产线运作逻辑； 3. 技能基础：熟悉半导体行业标准、生产SOP、异常分析、8D报告、良率优化流程；能独立对接产线、研发、品质跨部门协同工作； 4. 综合素质：逻辑清晰，具备独立问题排查与项目推进能力；熟悉洁净车间生产规范；可配合产线需求轮班/应急加班；熟练使用Office办公软件； 加分项： 熟悉车载芯片塑封工艺、抗潮耐温塑封制程经验优先。 Why TI? Engineer your future. We empower our employees to truly own their career and
岗位职责： 1. 负责半导体封装Die Attach（固晶/芯片贴装）工序量产工艺管控、参数调试与制程优化； 2. 主导固晶工序良率提升、制程异常分析、不良根因定位及闭环改善； 3. 编制、修订固晶工序工艺规范、作业指导书（SOP）、 FMEA、制程管控文件； 4. 负责新产品NPI导入、物料适配验证、固晶胶/芯片基材工艺适配测试； 5. 对接设备、品质、生产部门，解决量产端固晶偏移、虚焊、掉晶、气泡等工艺类不良问题。 任职基本要求： 1. 学历：全日制本科及以上学历，微电子、电子信息、材料工程、机械自动化、测控工程等相关理工科专业优先； 2. 工作经验：3年及以上半导体封装测试工厂量产工作经验，熟悉半导体封装工艺流程、产线运作逻辑； 3. 技能基础：熟悉半导体行业标准、生产SOP、异常分析、8D报告、良率优化流程；能独立对接产线、研发、品质跨部门协同工作； 4. 综合素质：逻辑清晰，具备独立问题排查与项目推进能力；熟悉洁净车间生产规范；可配合产线需求轮班/应急加班；熟练使用Office办公软件； 加分项： 熟悉主流固晶设备工艺逻辑；有功率器件/车载芯片,固晶工艺经验, SMT贴片讲演，flip chip经验优先。 Why TI? Engineer your future. We empower our employees to truly
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Job Details: Job Description: This role requires regular onsite presence to fulfill essential job responsibilities. Owns critical high volume manufacturing equipment and processes that enable rapid device miniaturization and the mass production of integrated circuits. Conducts
Company: Qualcomm China Job Area:Engineering Group, Engineering Group Software Engineering General Summary: You will design, implement, optimize, and maintain GStreamer plugins for streaming, hardware-accelerated video/audio encoding & decoding, muxing/demuxing, camera integration, GPU/NPU AI inference, and end-to-end
Company: Qualcomm China Job Area:Engineering Group, Engineering Group Software Engineering General Summary: Job Overview As part of the engineering team of Qualcomm China, mainly focus on robotics, action camera, smart wearables devices. we are looking for
Company: Qualcomm China Job Area:Engineering Group, Engineering Group Software Engineering General Summary: Interested in enabling next generation graphics, games, ray tracing, machine learning, image and video processing, even Mars drones? In the GPU Developer Tools team,
Company: Qualcomm China Job Area:Interns Group, Interns Group Interim Engineering Intern - SW General Summary: SW development on Qualcomm Chips. new feature design, technology investigation, system optimization, code developing and cross team co-work. There are some main
Company: Qualcomm China Job Area:Engineering Group, Engineering Group Software Engineering General Summary: We are looking for an experienced Embedded Linux Software Engineer to join our platform software team. This role focuses on Linux-based system development on Qualcomm chipsets,
Company: Qualcomm China Job Area:Engineering Group, Engineering Group Software Engineering General Summary: We are looking for an experienced Embedded Linux Software Engineer to join our platform software team. This role focuses on Linux-based system development on Qualcomm chipsets,
Company: Qualcomm China Job Area:Engineering Group, Engineering Group Software Engineering General Summary: Job Overview Qualcomm China is looking for experienced embedded SW engineers interested in developing software for IOT devices. Specifically, the position involves developing embedded software
Location(s) ChengDu, Sichuan, Sichuan Company Molex Career Field Engineering Job Number 183056 What You Will Do Review and interpret customer design requirements from Marketing, Sales or Customer drawings or specifications. Provide preliminary design feasibility review per
Location(s) ChengDu, Sichuan, Sichuan Company Molex Career Field Engineering Job Number 184983 Your Job Terminal Design Engineer is responsible for all phases of the product development, from concept to pre-production, including the multi-disciplinary actions necessary to meet customers’
Location(s) ChengDu, Sichuan, Sichuan Company Molex Career Field Engineering Job Number 187613 Your Job Connector Design Engineer is responsible for all phases of product development (Mini coax, twist pair type), from concept to pre-production, including the multi-disciplinary actions
Location(s) ChengDu, Sichuan, Sichuan Company Molex Career Field Sales Job Number 187844 Your Job Taking key role for TSBU Products growth in China Automotive market (including STD products, customized products and new developed products). Responsible for
Location(s) ChengDu, Sichuan, Sichuan Company Molex Career Field Engineering Job Number 187403 What You Will Do Review and interpret customer design requirements from Marketing, Sales or Customer drawings or specifications. Provide preliminary design feasibility review per