Company Description Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering product
Company Description Renesas is one of the top global semiconductor companies in the world. We strive to develop a safer, healthier, greener, and smarter world, and our goal is to make every endpoint intelligent by offering product
Company Description Job Summary • Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, wafer level, flip-chip, multi-chip module and power device packaging, GaN related PKG is a plus.
Responsibilities Responsible for analog / mixed-signal IP design for ARM-based MCU/MPU product development IP schematic design / analog & mix-signal simulation/ layout design / IP view generation / technical documentation Work with SoC / Backend team on IP integration.
Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the full potential of modern AI. Astera Labs’ Intelligent Connectivity Platform
· Power Semiconductor Assembly EOL Process Development · Technical Leadership on Enabling Technology Development and Feasibility Study in Pro-typing Line · Technical Leadership on Responsible Processes between Package development and Manufacturing · Proto Typing Samples Building Satisfying
Who We Are Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers