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Taking full responsibility for the Back EndMaterial roadmap for organic chip carrier (e.g. BGA/LGA). Cooperate withsuppliers in China & Global: build & establish good relationships with(new) suppliers, organize on-site (technical) visits, foster knowledgeexchanges. Your role Key
Identify and develop new wire bonding processes for products/packages,establish process controls to ensure high quality and reproducible manufacturing. Your Role Key responsibilities in your new role 1.Identify and develop new wire bonding processes for products/packages,establish process
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