Principal Responsibilities: • Responsible for performing functions associated with optical laser products • Performs testing and troubleshooting of complex systems, subassemblies and printed circuit boards • Test, operate, repair, and maintain lasers products that use or incorporate lasers •
Company Description Do you want beneficial technologies being shaped by your ideas? Whether in the areas of mobility solutions, consumer goods, industrial technology or energy and building technology - with us, you will have the chance
Location(s) Kunshan City, Jiangsu Company Molex Career Field Quality Job Number 191923 What You Will Do 1 Apply quality control experience across AQP, MQA, GCQ, and SQA activities to support new product development and mass production
SummaryImagine what you could do here. At Apple, new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. The people here don’t just build products — they craft the kind of
SIP 封装设备工程师（CM-SIP） 惠州 全职 职位描述 本岗位是保障SIP封装工序设备高效、稳定运行的关键技术专家。主导设备评估导入到全生命周期管理的各个环节，确保Molding（塑封）、Strip Grinding（条带研磨）、Laser Cut（激光切割） 三道关键工序的设备处于最佳状态，为产品良率、产能与可靠性提供坚实保障。1.设备技术管理与优化（40%）：作为Molding（塑封）、Strip Grinding（条带研磨）、Laser Cut（激光切割）三道工序的设备技术负责人，参与新设备的选型评估、安装调试与验收，确保其满足工艺与产能需求。负责主导或深度参与设备性能优化与稳定性提升项目，通过硬件改造、软件参数调试及备件升级，持续提升设备OEE（全局设备效率）与UPH（每小时产出）。对接客户与工艺团队，将工艺需求转化为设备技术参数与改造方案，并主导实施。2.设备维护与可靠性提升（40%）：建立并完善的预防性维护（PM）与全面生产维护（TPM）体系，制定和维护保养计划、点检标准。快速响应并主导解决设备重大故障、重复性异常及突发性宕机，进行根本原因分析，实施永久性纠正措施，并编写故障分析报告与OCAP（快速处理作业指导书）。负责关键备件的生命周期管理、国产化替代评估及库存优化。3.技术传承与客户支持（20%）：负责对设备技术员、操作员进行系统性培训，内容包括设备原理、标准化操作、日常点检、预防性保养及初级故障排查。编制及优化设备操作指导书（SOP）、维护保养手册（MM）及安全规程。作为设备专家，主导应对客户及第三方审核，负责设备相关的技术演示、数据提供与疑问解答。 职位要求 学历：本科及以上学历，机械工程、电气工程、自动化、机电一体化等相关专业。经验与技能：1.具备5年及以上半导体封装或精密制造行业设备维护/工程经验，其中至少3年专注于SIP、先进封装或类似高精度制造环境。2.必须精通Molding、Grinding、Laser Cut三类设备中至少两类（如TOWA/FICO塑封机、研磨机、激光切割设备等）的机械结构、电气控制、气液系统及日常维护。3.具备丰富的设备故障诊断与修复能力，能独立分析并解决复杂的机电软一体化问题。4.熟悉TPM体系，具备推动设备预防性维护和可靠性改善项目的实际经验。5.具备良好的跨部门沟通能力，能与工艺、生产、质量团队高效协作。优先条件:具备设备改造与性能提升项目的成功经验，如精度提升、速度优化、自动化上下料整合等。了解IATF 16949体系中设备管理相关要求。有与海外设备原厂进行技术交流或共同解决疑难问题的经验。 投递...
制造工艺工程经理（CM-SIP) 惠州 全职 生产制造类 职位描述 作为公司SIP技术实现与量产成功的核心驱动，领导工艺工程团队，是连接客户前沿需求与内部卓越制造的技术桥梁与战略管理者。具备SIP封测工艺技术深度，更需拥有将技术落地能力，确保项目从设计到量产的全面胜利，尤其在车载电子等高可靠性领域树立行业标杆。1. 客户技术战略伙伴 (25%)作为最终的技术接口，深度解读并转化客户对SiP产品（尤其是车载模块）在性能、可靠性（如AEC-Q100）与成本上的核心需求。主导技术提案（RFP响应）与制造方案评审，将客户需求精准转化为内部可执行的工艺、设计与测试战略。管理关键客户的技术期望与关系，主导阶段性技术汇报，清晰传递项目价值、进度与风险，建立坚实的客户信任。2. NPI项目全周期领导与交付 (40%)全面主导多个SiP项目的NPI流程，从设计评审（DFM/DFT）、工艺开发、原型制作（DVT）、过程验证（PV）到量产移交（MP），对项目的质量、交付时间与成本负最终管理责任。作为跨职能团队（设计、工艺、生产、质量、测试、供应链）的核心协调者，打破部门壁垒，高效解决项目冲突与瓶颈，确保团队协同作战。3. 工艺技术布局与团队赋能 (35%)作为SiP工艺技术权威，规划中长期技术路线图。主导前沿工艺（如SMT/FC/Molding/Grinding/Laser Cut等）、导入与成熟度提升，构建核心技术壁垒。领导团队通过DOE、SPC等工具进行工艺窗口优化与根本原因分析，持续提升量产良率、可靠性并降低损耗成本。负责重大工艺异常的技术决策与升级处理。负责工艺工程团队的搭建、培养、考核与激励。建立标准化知识体系（如设计规范、失效模式库、工艺标准），培养团队成为技术精湛、结果导向的专业力量。 职位要求 1、学历： 本科或以上学历，微电子、材料科学、电子工程、机械工程、化学工程等相关专业。2、必备：①5年及以上SMT or 半导体封装（尤其是SiP/先进封装）领域经验，其中至少3年专注于NPI或工艺/产品工程角色。具有车载电子相关项目经验者优先。② 熟悉常用工程软件、数据分析工具（如JMP, Minitab）、PLM/ERP系统、项目管理工具等。③英语作为工作语言，听说读写流利，能进行技术文档撰写、国际会议主持、报告呈现以及与全球客户/团队无障碍沟通。3、优先条件：①熟悉质量体系（IATF 16949, ISO 9001）和汽车行业核心工具（APQP, PPAP, FMEA, SPC, MSA）。②具备一定的封装仿真（热、力、电）知识。③有失效分析（FA） 实际操作经验。④有供应商管理或海外工厂对接经验。 投递...
Location: Shenzhen, China Job Summary: The Shenzhen Applications Engineering (AE) Team serves as a critical technical interface between customers, field application engineers (FAEs), and Semtechs global engineering organizations. Our mission is to accelerate customer success by
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About Us Our leading SaaS-based Global Employment Platform enables clients to expand into over 180 countries quickly and efficiently, without the complexities of establishing local entities. At G-P, we’re dedicated to breaking down barriers to global