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Other Packaging Engineer Jobs In China - 102 Job Positions Available

1 – 20 of 102 jobs
Hitachi jobs

Location:Suqian, Jiangsu, China Job ID: R0141383 Date Posted:2026-08-19 Company Name:HITACHI ENERGY JIANGSU HIGH VOLTAGE APPARATUS CO., LTD. Profession (Job Category):Engineering & Science Job Schedule: Full time Remote:No Job Description: The opportunity Hitachi Energy is renowned worldwide

Hitachi  29 days ago
Mondelēz International jobs

Job Description Are You Ready to Make It Happen at Mondelēz International? Join our Mission to Lead the Future of Snacking. Make It With Pride. Working as part of a cross functional team, you deliver the

Mondelēz International  23 days ago
AMD jobs

Locations: Suzhou, China Categories: Engineering Req ID: 91990 ADVANCE YOUR CAREER. ADVANCE THE WORLD. At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to

AMD  11 days ago
AMD jobs

Locations: Suzhou, China Categories: Engineering Req ID: 91989 ADVANCE YOUR CAREER. ADVANCE THE WORLD. At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to

AMD  11 days ago
Mattel jobs

Company Description CREATIVITY IS OUR SUPERPOWER. It’s our heritage and it’s also our future. Because we don’t just make toys. We create innovative products and experiences that inspire fans, entertain audiences and develop children through play.

Mattel  10 days ago
Stanley Black & Decker jobs

Responsibilities: Use software and design programs like Adobe Illustrator and InDesign to create packaging artwork, label and manuals. Work with dieline files to accurately place artwork for production and assembly. Determine that the graphic layout is properly

Stanley Black & Decker  8 days ago
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Stanley Black & Decker jobs

Responsibilities Responsible for the packaging structural design of finished goods and semi-finished goods; coordinate with suppliers on packaging structure development, arrange sample production, and complete packaging tests. Prepare product packaging structure documentation, including technical drawings, product packaging instructions, packaging method documents, product

Stanley Black & Decker  8 days ago
Renesas Electronics jobs

Job Description Design and develop Power Modules which use embedded die laminate technology with SMT of Cap and Inductor for Renesas’s packaging needs in the areas of Commercial Industrial power device packaging for servers and AI. Define package

Renesas Electronics  8 days ago
KLA jobs

Company Overview KLA is a global leader in diversified electronics for the semiconductor manufacturing ecosystem. Virtually every electronic device in the world is produced using our technologies. No laptop, smartphone, wearable device, voice-controlled gadget, flexible screen,

KLA  29 days ago
Avery Dennison jobs

Company Description Avery Dennison Corporation (NYSE: AVY) is a global materials science and digital identification solutions company. We are Making Possible products and solutions that help advance the industries we serve, providing branding and information solutions

Avery Dennison  29 days ago
Barco jobs

The NPI Service Engineer enables worldwide sales of Barco products by certification of Barco product for our markets in our product categories for: Product Safety which ensures safe use and servicing EMC, avoiding interference with nearby electronics

Barco  25 days ago
Höganäs AB jobs

About the Position Key Responsibilities A. Application Exploration & Opportunity Identification Proactively explore new surface coating applications across industries such as energy, aviation, automotive and general industrial sectors. Engage with customers, end users, research partners, and

Höganäs AB  24 days ago
Coherent Corp. jobs

Primary Duties & Responsibilities Serve as the NPI owner for InP-based optoelectronic components and assemblies, including lasers and photodiodes. Lead first-article builds, pilot production, product transfer, qualification support, and volume-ramp activities. Drive yield learning, risk identification,

Coherent Corp.  23 days ago
KLA jobs

Company Overview KLA is a global leader in diversified electronics for the semiconductor manufacturing ecosystem. Virtually every electronic device in the world is produced using our technologies. No laptop, smartphone, wearable device, voice-controlled gadget, flexible screen,

KLA  23 days ago
BorgWarner jobs

Position Summary Lead an engineering team in the product development process of transfer case (or related product ) mechanical hardware for customer 4WD applications. This includes the development of the initial proposal based on known customer

BorgWarner  22 days ago
Overview AI jobs

About Overview.ai Overview.ai is bringing the cutting edge of AI computer vision to manufacturing—solving inspection problems that were previously not solvable with traditional machine vision. We’re a full-stack company: we deploy GPU-powered cameras on production lines,

Overview AI  22 days ago
Wabtec Corporation jobs

Job Description Who will you be working with? We are an experienced engineering team in the rail transit industry, providing customers with passenger information systems and related products, bringing them convenient and comfortable experiences with advanced

Wabtec Corporation  22 days ago
Roche jobs

At Roche you can show up as yourself, embraced for the unique qualities you bring. Our culture encourages personal expression, open dialogue, and genuine connections, where you are valued, accepted and respected for who you are,

Roche  21 days ago
Microsoft jobs

Overview Role: Senior Software Engineer Do you have a passion for software design, engineering, debugging and problem-solving? Are you self-motivated, proactive, and results oriented, with the ability to generate clarity in ambiguous situations, ramp up quickly, understand

Microsoft  21 days ago
Renesas Electronics jobs

Company Description Job Summary • Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, wafer level, flip-chip, multi-chip module and power device packaging, GaN related PKG is a plus. •

Renesas Electronics  18 days ago

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