Duties & Responsibilities Familiar with semiconductor process and high-end packaging process. Having mechanics and thermodynamics knowledge is prefer. Experience in thermal analysis is prefer, understand FloTherm or Ansys. Understand quality solutions, Minitab, or other reliability and statistical analysis
Join our Team What you will do: Board power solution and design for radio products, Baseband products and network router products. DCDC power solution design, including lightning protection, polarity protection, hot-swap, EMC filter, power stage and
Company: Qualcomm China Job Area:Engineering Group, Engineering Group Software Engineering General Summary: Role Summary We are seeking a Principal/Director-level technical leader to drive Robotics Solution strategy with a primary focus on robotics software ecosystem, customer architecture
Location(s) Zhuhai, Guangdong Company Molex Career Field Engineering Job Number 183225 Your Job Opto-Electrical Components packaging process development and optimization. What You Will Do 1. Based on the product design requirement from PM or PDE, define new
Greif is a global leader in performance packaging located in 40 countries. The company delivers trusted, innovative, and tailored solutions that support some of the worlds most in demand and fastest-growing industries. With a commitment to