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Location(s) ChengDu, Sichuan, Sichuan Company Molex Career Field Supply Chain Job Number 184708 Your Job The owner of the framework for GSOP&E DCC (Document Control Center) and is responsible for GSOP&E DCC processes establish and maintenance,
Overview: We are seeking an experienced Senior Data Project Manager to lead the initiation, planning, execution, and governance of complex data initiatives across the Asia region. This role focuses on data analytics, business intelligence (BI), AI transformation, and data governance
Overview The Asia Data Office is looking for an experienced Senior Full-stack Engineer to support regional data and AI initiatives. This role is ideal for a hands-on engineer who can design and build robust data pipelines, contribute to enterprise
The Asia Data Office is looking for an experienced Senior Data Analyst to join our team to support our regional partners. If you have passion for data and a desire to drive quality data solutions within a data driven culture, then
岗位职责： 1. 兼顾Wire Bond（引线键合）工序工艺管控+设备运维全模块工作； 2. 负责金线/铝线/铜线焊线制程参数优化、量产良率管控、打火不良、断线、拉力不达标等工艺异常整改； 3. 负责焊线机台日常保养、故障维修、设备校准、机台稼动率提升； 4. 完成焊线工序新产品导入、工艺验证、工艺文件编制； 5. 统筹焊线工序工艺和设备类问题闭环，推进产线标准化落地。 任职基本要求： 1. 学历：全日制本科及以上学历，微电子、电子信息、材料工程、机械自动化、测控工程等相关理工科专业优先； 2. 工作经验：3年及以上半导体封装测试工厂量产工作经验，熟悉半导体封装工艺流程、产线运作逻辑； 3. 技能基础：熟悉半导体行业标准、生产SOP、异常分析、8D报告、良率优化流程；能独立对接产线、研发、品质跨部门协同工作； 4. 综合素质：逻辑清晰，具备独立问题排查与项目推进能力；熟悉洁净车间生产规范；可配合产线需求轮班/应急加班；熟练使用Office办公软件； 加分项： 具备键合拉力、球剪测试实操经验；熟悉半导体引线键合行业标准优先。 Why TI? Engineer your future. We empower our employees to truly own their
岗位职责： 1. 负责半导体Molding（环氧塑封）工序全流程工艺管控、参数优化、量产制程维护； 2. 解决塑封工序溢料、空洞、分层、翘曲、封装开裂等工艺量产不良； 3. 负责塑封料物料验证、固化工艺优化、产品外观及电性一致性管控； 4. 编制塑封工序工艺标准、生产管控文件，推进制程能力CPK提升； 5. 参与封装产品结构评审、新产品塑封方案落地与试产跟进。。 任职基本要求： 1. 学历：全日制本科及以上学历，微电子、电子信息、材料工程、机械自动化、测控工程等相关理工科专业优先； 2. 工作经验：3年及以上半导体封装测试工厂量产工作经验，熟悉半导体封装工艺流程、产线运作逻辑； 3. 技能基础：熟悉半导体行业标准、生产SOP、异常分析、8D报告、良率优化流程；能独立对接产线、研发、品质跨部门协同工作； 4. 综合素质：逻辑清晰，具备独立问题排查与项目推进能力；熟悉洁净车间生产规范；可配合产线需求轮班/应急加班；熟练使用Office办公软件； 加分项： 熟悉车载芯片塑封工艺、抗潮耐温塑封制程经验优先。 Why TI? Engineer your future. We empower our employees to truly own their career
岗位职责： 1. 负责半导体封装Die Attach（固晶/芯片贴装）工序量产工艺管控、参数调试与制程优化； 2. 主导固晶工序良率提升、制程异常分析、不良根因定位及闭环改善； 3. 编制、修订固晶工序工艺规范、作业指导书（SOP）、 FMEA、制程管控文件； 4. 负责新产品NPI导入、物料适配验证、固晶胶/芯片基材工艺适配测试； 5. 对接设备、品质、生产部门，解决量产端固晶偏移、虚焊、掉晶、气泡等工艺类不良问题。 任职基本要求： 1. 学历：全日制本科及以上学历，微电子、电子信息、材料工程、机械自动化、测控工程等相关理工科专业优先； 2. 工作经验：3年及以上半导体封装测试工厂量产工作经验，熟悉半导体封装工艺流程、产线运作逻辑； 3. 技能基础：熟悉半导体行业标准、生产SOP、异常分析、8D报告、良率优化流程；能独立对接产线、研发、品质跨部门协同工作； 4. 综合素质：逻辑清晰，具备独立问题排查与项目推进能力；熟悉洁净车间生产规范；可配合产线需求轮班/应急加班；熟练使用Office办公软件； 加分项： 熟悉主流固晶设备工艺逻辑；有功率器件/车载芯片,固晶工艺经验, SMT贴片讲演，flip chip经验优先。 Why TI? Engineer your future. We empower our employees to
主要工作职责： • 负责制定优化芯片制造工艺标准，撰写工艺文件，定义工艺参数，处理生产异常； • 通过提高工艺稳定性，优化产品质量，降低生产成本，提升制造产能和产品的市场竞争力； • 负责新产品量产前工艺监控，提前发现问题并采取预防措施； • 负责新工艺开发，突破现有工艺瓶颈。 我们在寻找 • 本科/硕士学历，理工科专业，2025/2026届毕业生且工作经验小于24个月 • 良好的英语听说能力； • 良好的问题分析和独立思考能力； • 积极主动，具有团队合作精神； • 较强的人际交往及沟通能力。 Why TI? Engineer your future. We empower our employees to truly own their career and development.
Responsibilities: Follow up the SOP to proceed related cases. Keep the quality of delivery at or above an acceptable level. Keep the Turn-around-time of delivery at or above an acceptable level. To follow up the specific
Summary of Responsibilities: Site management responsibility for clinical studies according to Fortrea’s Standard Operating Procedures, ICH GCP Guidelines, applicable project plans and Sponsor requirements, including verification of study training records. Conducts site monitoring responsibilities for clinical
Summary of Responsibilities: Site management responsibility for clinical studies according to Fortrea’s Standard Operating Procedures, ICH GCP Guidelines, applicable project plans and Sponsor requirements, including verification of study training records. Conducts site monitoring responsibilities for clinical
Summary of Responsibilities: Site management responsibility for clinical studies according to Fortrea’s Standard Operating Procedures, ICH GCP Guidelines, applicable project plans and Sponsor requirements, including verification of study training records. Conducts site monitoring responsibilities for clinical
Work ScheduleStandard (Mon-Fri) Environmental ConditionsOffice Job Description Join Us as a Clinical Research Associate (Level II) – Make an Impact at the Forefront of Innovation We have successfully supported the top 50 pharmaceutical companies and more
Company: Qualcomm China Job Area:Engineering Group, Engineering Group Software Engineering General Summary: You will design, implement, optimize, and maintain GStreamer plugins for streaming, hardware-accelerated video/audio encoding & decoding, muxing/demuxing, camera integration, GPU/NPU AI inference, and end-to-end
Amazon strives to be Earths most customer-centric company where people can find and discover virtually anything they want to buy online. To serve the goal, Amazon has created one of the most advanced fulfillment and logistic
Monolithic Power Systems, Inc. (MPS) is one of the fastest growing companies in the Semiconductor industry. We are worldwide technical leaders in Integrated Power Semiconductors and Systems Power delivery architectures. At MPS, we cultivate creativity, are
Location(s) ChengDu, Sichuan, Sichuan Company Molex Career Field Engineering Job Number 183056 What You Will Do Review and interpret customer design requirements from Marketing, Sales or Customer drawings or specifications. Provide preliminary design feasibility review per
Location(s) ChengDu, Sichuan, Sichuan Company Molex Career Field Engineering Job Number 184637 Your Job Lead and enhance failure & material analysis capabilities in Chengdu Lab, providing technical leadership to streamline processes and develop world-class analysis expertise.
Location(s) ChengDu, Sichuan, Sichuan Company Molex Career Field Business Strategy & Development Job Number 185219 Your Job Work in close coordination with the Global Product Manager to define and execute the product development and strategy of