Package Designer Jobs In China - 25 Job Positions Available

Senior Interior Designer, Facilities - (260000F2) Job Summary Towson University (TU) has earned distinction as both a top-100 public university and one of the nations great colleges to work for. Located north of Baltimore, TU currently enrolls

Be part of something altogether life-changing! Working at Cytiva means being at the forefront of providing new solutions to transform human health. Our incredible customers undertake life-saving activities ranging from fundamental biological research to developing innovative

Who we are Since 1843, The Economist Group has championed independence, excellence and openness, helping people understand and tackle the critical challenges shaping the world. Today, we are building on that legacy as a global media

REQ13409 Assistant Manager, Project & Traffic (Open) POSITION SUMMARY: Assists the Project Manager in reviewing and overseeing job briefs and projects for the Melco Content Studio team. These will come from the business units within City

NVIDIA is a leader in accelerated computing and AI, driving breakthroughs in technology and innovation. Our Silicon Co-design Group focuses on developing cutting-edge silicon solutions, pushing the boundaries of performance in our products. We are looking

JLL empowers you to shape a brighter way. Our people at JLL are shaping the future of real estate for a better world by combining world class services, advisory and technology for our clients. We are

About Us About UsCentric Brands is a leading lifestyle brand collective that designs, sources, markets and sells high quality products in multiple segments, including women’s, men’s and kid’s apparel, accessories, entertainment and beauty. Centric Brands is

Rockwell Automation is a global technology leader focused on helping the world’s manufacturers be more productive, sustainable, and agile. With more than 28,000 employees who make the world better every day, we know we have something

PLAY, GROW and WIN To be a part of Virtuos means to be a creator. At Virtuos, we harness the latest technologies to make games better and more immersive than ever before. That is why we

Job Description Job Description | 职位描述 Responsible for designing and developing high-quality PCB layouts for complex automotive or industrial electronic products, ensuring designs meet stringent electrical performance, signal integrity, mechanical fit, and manufacturability requirements. 负责为复杂的汽车电子产品设计和开发高质量的PCB，确保设计满足严格的电气性能，信号完整性，机械装配及可制造性要求。 Act

At Mentee Robotics, we are redefining humanoid automation with an AI-first approach - combining perception, reasoning, and dexterous manipulation into fully autonomous systems that continuously learn and adapt. We are now expanding with a new robotics

Job Summary: This product focused position applies specialized knowledge of engineering principles and design practices to create optimized design concepts and mechanical design specifications considering application, cost, weight, performance, reliability, durability, manufacturing, assembly, and serviceability. This

Location(s) Shijie Town, Dongguan, Guangdong Company Molex Career Field Engineering Job Number 186883 Position Overview Molex is seeking a Senior Signal Integrity Engineer to join a team within our Copper Solutions Business Unit that designs, analyzes,

Job Purpose · Ag Sintering Process Development for Power Module and Discrete with SiC · New Process and Package Development for High Power Discrete and Module Package · New Sintering Material Development for Discrete and Module · Technical

Company Description We are 10 Design, (part of Egis’ Architecture Line), a dynamic and innovative architecture and master planning practice. With over 400 architects and designers strategically located across three regional headquarters in London, Hong Kong, and

【27届校招】芯片封装设计工程师 上海 正式 研发 - 电子 / 半导体 职位描述 1. 负责SoC芯片封装选型的方案评估与对比分析，包括封装形式（BGA、LGA、WLCSP等）、引脚数、基板层数、尺寸及成本等关键参数的综合考量，识别并规避封装实现中的风险点（如bump密度、信号出线可行性、电源分配网络等）。2. 配合芯片后端设计团队，统筹整理bump布局的规划与优化，独立完成bump/ball map的绘制、版本维护及设计规则检查，确保布局满足封装工艺和电气性能要求。3. 负责封装基板（Substrate）layout设计中的评审文档整理、版本管控及设计变更追踪，参与设计Review会议并输出会议纪要及行动项跟踪。4. 参与封装材料（ABF/BT基板、underfill胶、TIM热界面材料等）的选型评估与供应商技术沟通，建立材料参数库，为设计选型提供数据支撑。5. 协同工艺、可靠性及测试团队，参与封装方案的可行性评审，推动封装设计从概念到量产的顺利落地。6. 跟踪先进封装技术趋势（如2.5D/3D封装、Chiplet、Fan-Out等），参与技术预研与内部规范制定，提升团队封装设计整体能力。 职位要求 1. 学历专业：本科及以上学历，微电子、电子工程、机械工程、材料科学与工程等相关专业。2. 理论基础：具备扎实的半导体封装基础知识，理解芯片封装流程、基板结构、互连方式（引线键合/倒装焊）及常见封装失效模式。3. 工具能力：熟练使用至少一种电子设计或绘图工具（如Allegro Package Designer、Altium Designer等），有实际的封装或PCB设计项目经验（含课程设计）。4. 业务理解：了解封装设计中信号/电源完整性的基本约束，能理解bump/ball map设计中对SI/PI的考量要求。5. 软技能：工作细致认真，具备良好的文档编写习惯和跨团队沟通协调能力，能主动跟进任务闭环。6. 抗压能力：具备较强的学习内驱力，能快速适应研发项目节奏，按时交付高质量成果。 投递...