Littelfuse (NASDAQ: LFUS) is a diversified industrial technology manufacturing company shaping solutions for the safe and efficient transfer of electrical energy. Headquartered in Chicago, Illinois, USA, we serve customers across industrial, transportation, and electronics markets worldwide.
Who We Are Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our
Who We Are Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our
Who We Are Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our
Job Summary: Lead timely and effective new product introduction from engineering build through qualification and initial manufacturing release. Drive design-for-manufacturability, process readiness, first-pass qualification success, yield improvement, cost competitiveness, and smooth transfer to production in alignment with
Who We Are Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our
Who We Are Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our
Job Purpose · Ag Sintering Process Development for Power Module and Discrete with SiC · New Process and Package Development for High Power Discrete and Module Package · New Sintering Material Development for Discrete and Module · Technical
Who We Are Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our
Who We Are Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our
Duties & Responsibilities Ensure statistical process control, yield and scrap cost tracking are established and maintained within the engineering subdivision to improve the process flow. Implement and develop yield improvements and perform troubleshooting of existing procedures where necessary.
SummaryJoin Apples Hardware Technology team in the Display PPO group, where we push the boundaries of TFT architecture and next-generation display technologies. As a Process & Integration Engineer, youll be at the forefront of innovation, working on cutting-edge
SummaryStep into the world of Apple, where innovation meets precision and imagination transforms into reality. Within the Camera Process Development and Engineering team, we push the boundaries of what’s possible in mobile imaging — shaping the next
Requisition Number: 74780 The company built on breakthroughs. Join us. Corning is one of the world’s leading innovators in glass, ceramic, and materials science. From the depths of the ocean to the farthest reaches of space,
岗位职责： 1. 兼顾Wire Bond（引线键合）工序工艺管控+设备运维全模块工作； 2. 负责金线/铝线/铜线焊线制程参数优化、量产良率管控、打火不良、断线、拉力不达标等工艺异常整改； 3. 负责焊线机台日常保养、故障维修、设备校准、机台稼动率提升； 4. 完成焊线工序新产品导入、工艺验证、工艺文件编制； 5. 统筹焊线工序工艺和设备类问题闭环，推进产线标准化落地。 任职基本要求： 1. 学历：全日制本科及以上学历，微电子、电子信息、材料工程、机械自动化、测控工程等相关理工科专业优先； 2. 工作经验：3年及以上半导体封装测试工厂量产工作经验，熟悉半导体封装工艺流程、产线运作逻辑； 3. 技能基础：熟悉半导体行业标准、生产SOP、异常分析、8D报告、良率优化流程；能独立对接产线、研发、品质跨部门协同工作； 4. 综合素质：逻辑清晰，具备独立问题排查与项目推进能力；熟悉洁净车间生产规范；可配合产线需求轮班/应急加班；熟练使用Office办公软件； 加分项： 具备键合拉力、球剪测试实操经验；熟悉半导体引线键合行业标准优先。 Why TI? Engineer your future. We empower our employees to truly own their career
岗位职责： 1. 负责半导体Molding（环氧塑封）工序全流程工艺管控、参数优化、量产制程维护； 2. 解决塑封工序溢料、空洞、分层、翘曲、封装开裂等工艺量产不良； 3. 负责塑封料物料验证、固化工艺优化、产品外观及电性一致性管控； 4. 编制塑封工序工艺标准、生产管控文件，推进制程能力CPK提升； 5. 参与封装产品结构评审、新产品塑封方案落地与试产跟进。。 任职基本要求： 1. 学历：全日制本科及以上学历，微电子、电子信息、材料工程、机械自动化、测控工程等相关理工科专业优先； 2. 工作经验：3年及以上半导体封装测试工厂量产工作经验，熟悉半导体封装工艺流程、产线运作逻辑； 3. 技能基础：熟悉半导体行业标准、生产SOP、异常分析、8D报告、良率优化流程；能独立对接产线、研发、品质跨部门协同工作； 4. 综合素质：逻辑清晰，具备独立问题排查与项目推进能力；熟悉洁净车间生产规范；可配合产线需求轮班/应急加班；熟练使用Office办公软件； 加分项： 熟悉车载芯片塑封工艺、抗潮耐温塑封制程经验优先。 Why TI? Engineer your future. We empower our employees to truly own their career and
岗位职责： 1. 负责半导体封装Die Attach（固晶/芯片贴装）工序量产工艺管控、参数调试与制程优化； 2. 主导固晶工序良率提升、制程异常分析、不良根因定位及闭环改善； 3. 编制、修订固晶工序工艺规范、作业指导书（SOP）、 FMEA、制程管控文件； 4. 负责新产品NPI导入、物料适配验证、固晶胶/芯片基材工艺适配测试； 5. 对接设备、品质、生产部门，解决量产端固晶偏移、虚焊、掉晶、气泡等工艺类不良问题。 任职基本要求： 1. 学历：全日制本科及以上学历，微电子、电子信息、材料工程、机械自动化、测控工程等相关理工科专业优先； 2. 工作经验：3年及以上半导体封装测试工厂量产工作经验，熟悉半导体封装工艺流程、产线运作逻辑； 3. 技能基础：熟悉半导体行业标准、生产SOP、异常分析、8D报告、良率优化流程；能独立对接产线、研发、品质跨部门协同工作； 4. 综合素质：逻辑清晰，具备独立问题排查与项目推进能力；熟悉洁净车间生产规范；可配合产线需求轮班/应急加班；熟练使用Office办公软件； 加分项： 熟悉主流固晶设备工艺逻辑；有功率器件/车载芯片,固晶工艺经验, SMT贴片讲演，flip chip经验优先。 Why TI? Engineer your future. We empower our employees to truly
Step into a career with ASM, where cutting edge technology meets collaborative culture. For over 55 years ASM has been ahead of what’s next, at the forefront of innovation and what’s technologically possible. With more
主要工作职责： • 负责制定优化芯片制造工艺标准，撰写工艺文件，定义工艺参数，处理生产异常； • 通过提高工艺稳定性，优化产品质量，降低生产成本，提升制造产能和产品的市场竞争力； • 负责新产品量产前工艺监控，提前发现问题并采取预防措施； • 负责新工艺开发，突破现有工艺瓶颈。 我们在寻找 • 本科/硕士学历，理工科专业，2025/2026届毕业生且工作经验小于24个月 • 良好的英语听说能力； • 良好的问题分析和独立思考能力； • 积极主动，具有团队合作精神； • 较强的人际交往及沟通能力。 Why TI? Engineer your future. We empower our employees to truly own their career and development. Come
Duties & Responsibilities 1. Proficient in the entire process of optical cold processing, including cutting (internal circular cutting, slicing cutting, line cutting), grinding, polishing (double-sided polishing, ring polishing, classical polishing, high/low polishing), etc. 2. Familiar with optical