公司描述 万诺电子致力于为医疗科技与生命科学、工业与自动化、航空航天与国防，以及智能基础设施与环境等对可靠性要求极高的行业，提供电子解决方案的研发与制造服务。作为创新企业和市场领导者的长期战略合作伙伴，我们具备覆盖整个价值链的服务能力，涵盖从概念设计、工程开发，到经验证的元器件供应及全球化生产。我们在瑞士、德国、克罗地亚、罗马尼亚、斯里兰卡、新加坡、中国、美国及墨西哥设有全球生产网络，拥有超过2,800名员工，齐心协力将各种创意转化为稳定可靠的电子系统。 职位描述 硬件架构设计： 定义并设计嵌入式系统的硬件架构；根据处理能力、I/O 数量、外设及成本，评估并选择最佳的通用 MCU（微控制器）。 原理图设计： 独立完成电路原理图设计，了解 PCB 设计的基础知识，确保良好的信号完整性、电源分配及热管理。 善用 MCU 内部资源（如 ADC、DAC、PWM、定时器等），设计出高可靠性的接口电路。 实现并优化常用的通信接口与总线，包括 UART、I2C、SPI、CAN 和 RS485。 设计可靠的电源树（DC-DC 转换器、LDO），为 MCU 及外设组件提供稳定、低噪声的电源。 板卡调试与排错（Board Bring-up）： 负责硬件板卡的上电调试、信号测量及故障排查；与固件工程师紧密协作，验证硬件功能及外设驱动。 测试与合规： 执行硬件验证测试、环境测试，并排查 EMC/EMI（电磁兼容/电磁干扰）问题，以确保产品的可靠性并符合法规标准。 职位要求 电子工程、自动化、通信工程、计算机工程或相关专业，本科及以上学历。 具备嵌入式硬件产品设计与开发经验。 硬实力/技术技能： MCU 平台： 深入理解
Company: Qualcomm China Job Area:Engineering Group, Engineering Group Software Engineering General Summary: Join our China IoT Audio Software Development team and deliver high-quality audio/voice solutions on Qualcomm SoCs for Snapdragon IoT platforms. Skills/Experience 5+ years of
RESPONSIBILITIES: Assess technical feasibility through comprehensive analysis, precise problem definition, thorough requirements gathering, and evaluation of proposed solutions. Engineer robust and well-structured software that adheres to design criteria and meets performance objectives. Formulate proposals and work schedules
Company: Qualcomm China Job Area:Interns Group, Interns Group Interim Engineering Intern - SW General Summary: Based on Qualcomm chipset reference design products, design, develop, and implement automation test cases for embedded system testing. Responsibilities include, but not
Company: Qualcomm China Job Area:Interns Group, Interns Group Interim Engineering Intern - SW General Summary: Design, develop, and perform automation function/system validation cases for Qualcomm SoC Chipsets. Responsibilities include, but not limited to: 1. Develop and
Company: Qualcomm China Job Area:Interns Group, Interns Group Interim Engineering Intern - SW General Summary: SW development on Qualcomm Chips. new feature design, technology investigation, system optimization, code developing and cross team co-work. There are some
Minimum qualifications: Bachelors degree in Computer Science, Electrical Engineering, Computer Engineering, a related technical field, or equivalent practical experience. 2 years of experience coding in low level systems programming languages (e.g., C++ or C) and in
Company Description Job Summary • Design and develop package and interconnect methods for Renesas’s packaging needs in the areas of Power SiP/modules, wafer level, flip-chip, multi-chip module and power device packaging, GaN related PKG is a
About Analog Devices Analog Devices, Inc. (NASDAQ: ADI) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, AI, and software technologies into
At Cadence, we hire and develop leaders and innovators who want to make an impact on the world of technology. Primary Responsibilities: ○ Supporting pre-silicon integration, usage, and implementation of memory subsystem products ○ Helping with
Eaton is an intelligent power management company dedicated to protecting the environment and improving the quality of life for people everywhere. We make products for the data center, utility, industrial, commercial, machine building, residential, aerospace and
Flex is the diversified manufacturing partner of choice that helps market-leading brands design, build and deliver innovative products that improve the world. A career at Flex offers the opportunity to make a difference and invest in
Job descriptions may display in multiple languages based on your language selection. What we offer: At Magna, you can expect an engaging and dynamic environment where you can help to develop industry-leading automotive technologies. We invest
Job descriptions may display in multiple languages based on your language selection. What we offer: At Magna, you can expect an engaging and dynamic environment where you can help to develop industry-leading automotive technologies. We invest
Responsibilities About Us Embedded in client environments, this role leads Forward Deployed Engineers (FDEs) to rapidly develop and debug AI applications to accomplish production-grade deployment, while driving product feature iteration. Responsibilities - Develop a deep understanding of client
Responsibilities About Us Embedded in customer environments, this role will rapidly develop and debug AI applications to accomplish production-grade deployment, while driving product feature iteration. Responsibilities - Develop a deep understanding of customers’ business scenarios, rapidly build
Job descriptions may display in multiple languages based on your language selection. What we offer: At Magna, you can expect an engaging and dynamic environment where you can help to develop industry-leading automotive technologies. We invest
Company Description About Grab and Our Workplace Grab is Southeast Asias leading superapp. From getting your favourite meals delivered to helping you manage your finances and getting around town hassle-free, weve got your back with everything.
Change the world. Love your job.In your first year with TI, you will participate in the Career Accelerator Program (CAP), which provides professional and technical training and resources to accelerate your ramp into TI and set
1. Enhance R&D efficiency through AI technology application and implementation 2. AI Application Development and Project Delivery Lead AI project requirements analysis, technical solution design, and product delivery Complete fine-tuning, alignment, and inference optimization for general